HIGH UPH
- TCNCP Upto 1500 UPH @ 3um
- TCCUF Upto 2000 UPH @ 3um
- MTD Upto 2500 UPH @ 3um
- STD FC Upto 5000 UPH @ 5um
HIGH SPEED BONDING
- 4 Head Bonding System
- Precision Pre-bond Die Centering
- Built in Substrate Fluxing
- Dip fluxing without cycle time loss
- Thermal Application Versatility
HIGH SPEED DISPENSING (Optional)
- Upto 2000 UPH @ 50um
- Volume Precision Upto +/-5%
Melt and Touch Down (MTD)
- High Throughput Thermal Bonding
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